2014 2(15)

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   Short abstract

 

Pages:

68 - 71

Language:

RU

Ref.:

7

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2014_2(15)_14.pdf

 
 

DESIGN OF TECHNOLOGICAL EQUIPMENT FOR THE CONTROL OF MICROCIRCUITS OF MICROSYSTEM TECHNOLOGY PRODUCTS

Nevlyudov I.S., Palagin V.A., Razumov-Frizyuk E.A., Zharikova I.V.

Kharkov National University of Radio Electronics, Kharkov, Ukraine

Citation:

Nevlyudov, I.S., Palagin, V.A., Razumov-Frizyuk, E.A. and Zharikova, I.V., (2014) Design of technological equipment for the control of microcircuits of microsystem technology products, Modern Science: Researches, Ideas, Results, Technologies, Iss. #2(15), PP. 68 - 71.

Keywords:

MEMS

Abstracts:

The work is dedicated to the design and simulation of MEMS devices, which is using for testing of components in BGA / CSP-bodies. A fundamentally new multiprobe connectable device (MPCD) which is used for input and functional control of microchips is offered. That MPCD has the ability to verify the connection parameters. The prototype features of MPCD’s clamp plate for chips in the FG-320 body are considered.

References:

  1. Semenets V.V. Tekhnologiya mezhsoedineny elektronnoy apparatury: ucheb. dlya vuzov / V.V. Semenets, Dzh. Kratts, I. Sh. Nevlyudov, V.A. Palagin. - Kh.: "SMIT", 2005. - 432 pp.

  2. Patent № 95190 Ukrayiny. Mikroelektro-mekhanichnyy bahatozondovyy pidmykalnyy prystriy / Borshchov V.N., Zharikova I.V., Koshchiy L.D., Listratenko O.M., Nevlyudov I. Sh., Palahin V.A., Razumov-Fryzyuk Ye.A., Tymchuk I.T. ta in. - 11.07.2011.

  3. Patent № 97538 Ukrayiny. Mikroelektro-mekhanichnyy bahatozondovyy kontaktnyy prystriy / Borshchov V.N., Koshchiy L.D., Nevlyudov I. Sh., Palahin V.A., Protsenko M.A., Razumov-Fryzyuk Ye.A., Tertyshnyy S.M., Tymchuk I.T. - 27.02.2012.

  4. Nevlyudov I. Sh. Podklyuchayushchee MEMS-ustroystvo dlya kontrolya BGA-komponentov / I. Sh. Nevlyudov, R.M. Martynyak, V.A. Palagin, B.S. Slobodyan, E.A. Razumov-Frizyuk, I.V. Zharikova, M.I. Dmitriv, A.S. Belyaev // Tekhnologiya i konstruirovanie v elektronnoy apparature. - 2012, №1. - pp. 54 - 56.

  5. Ching-Mai Ko. Nadezhnost testirovaniya BGA-komponentov / Ko Ching-Mai, Chen Ming-Kun, Huang Yu-Jung, Fu Shen-Li // Tekhnologii v elektronnoy promyshlennosti. - 2009. - №4. - pp. 38 - 42.

  6. Fine Pitch BGA (FG320/ FGG320) Package // Xilinx, Inc. - PK071 (v1.2.1). - March 23, 2005.

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