|
|
|
CAUSES OF MECHANICAL STRESSES IN DEPOSITED BY MAGNETRON SILICON CARBIDE AND ALUMINUM NITRIDE FILMS
Astashenkova O.N., Korlyakov A.V.
Saint Petersburg Electrotechnical University "LETI", St.Peterburg, Russia
|
Citation:
Astashenkova, O.N. and Korlyakov, A.V., (2014) Causes of mechanical stresses in deposited by magnetron silicon carbide and aluminum nitride films, Modern Science: Researches, Ideas, Results, Technologies, Iss. #2(15), PP. 57 - 61.
|
|
Keywords:mechanical stress; silicon carbide; aluminum nitride; micromechanical membrane; magnetron deposition |
|
Abstracts:
The results of internal stress determination in the aluminum nitride and silicon carbide films are presented. The effect of induced potential on the mechanical stress of films during magnetron deposition is shown. Feasible mechanisms of mechanical stress formation in films in terms of the induced potential are considered. It is shown that internal stresses in semiconductor films strongly depend on the ionized impurity electrodiffusion under the influence of the film potential gradient. |
|
References:
Korlyakov A.V., Luchinin V.V., Mal'tsev P.P. (1999) "SIC-ALN-based microelectromechanical structures" Russian microelectronics, - Vol.28, no.3, - рp. 168-177 Astashenkova, O.N. and Korlyakov, A.V. (2013) "The Physical and Mechanical Parameters Control of Thin Films" Journal of NANO and MICROSYSTEM TECHNIQUE, no.2, pp.24-29 Bochow, O.S., Dukhnovsky, M.P., Kozyrev, A.B., Korlyakov, A.V., Korolev, A.N., Lagos, A.V., Luchinin, V.V., Toptalov, S.I. (2012) "Low-Power Consumption Small-Sized Radiofrequency Modules Based on RF MEMS Switch" Journal of NANO and MICROSYSTEM TECHNIQUE, no.12, pp.60-71 Efremenko, A.M., Korlyakov, A.V., Krivosheeva, A.N., Luchinin V.V. (2007) "Deposition of grain-oriented aluminum nitride layers for micromechanical actuator", Vacuum equipment and technology, vol.17, no.3, pp.189-198 Efremenko, A.M., Korlyakov, A.V., Astashenkova, O.N., Krivosheeva, A.N. (2012) "Low-Temperature Synthesis of Aluminium Nitride Textured Films on Heterogeneous Waters for MEMS Devices", Journal of NANO and MICROSYSTEM TECHNIQUE , №12, pp.25-30
|
|
|
